Automatic alignment test on wafer, simple and fast operation, high resolution and MAP display function.
Measuring type: 3 inch, 4 inch
Test silicon wafer unit size: 20—200 mil
Positioning accuracy: ≤ ± 0.01mm / 110mm
Automatic alignment accuracy: ± 0.01mm
Mistest rate: ≤ 1 ‰
Automatic registration time: ≤ 15 s
Test speed 45 mil 5.0 pcs / s
50 mil 4.6 pcs / s
87 mil 4.2 pcs / s
Step resolution: 0.001
Z direction travel: 0 ～ 5mm adjustable
Turning angle θ of the stage: ± 20o
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CP300 type automatic alignment probe station can The automatic alignment test on the wafer is easy to operate. Fast, high test accuracy, with MAP display function can. It can be completed automatically after connecting with the tester Test and function of electrical parameters of various transistor cores Test. |
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Operation method
CP300 type automatic alignment probe station
機(jī)器軟件的操作界面 |
In addition, a more concise party is provided. 
功能小鍵盤 |
Machine function
With automatic scanning registration function, registration accuracy |
With circular test, range retest, edge detection Test, range dot, recycling test, rectangle Test and offline test multiple test functions.  |
| With X, Y, Z three-axis motion structure, soft operation It can accurately compensate the verticality and flatness. Prove the machine's control accuracy and work stability.  |
With real-time RBI, offline RBI and lag After RBI function. New type of marking device, in use Time is up to 3 days, no ink is dripped, and 60% of operation time is saved.  |
| With Z-axis stroke segmented motion function, its Divided into basic height, contact height, contact buffer, Overshoot and foldback height with edge detection Function to prevent probe-to-chip during test Scratches and poor contact between the probe and the chip.  |
Test pin mark ratio picture (reflective white point is pin mark)
Multiple cores Single core |
